Issues Related to PCB Manufacturing Issues
25/12/2021 Computers - Hardware
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Description
These are plated through-holes and are the conductive connection between the inner layers of a PCB. Defects occur due to lack of control in the manufacturing steps while fabricating through-holes.
After the board undergoes thermal processes (reflow, wave soldering, or rework), an open circuit failure caused by inner-layer separation can cause intermittent electrical open or complete open. Plating separation (the separation between a plating layer and copper foil) is one different type of interconnect defect. Interconnect defects may appear during PCB Manufacturing when the weak adhesion between the electroless copper and the inner layer copper or between electroless copper and the electrolytic copper undergoes thermal processes.
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