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The thickness of the substrate affects the propagation delay of signals traveling through the PCB. Thinner substrates generally have lower propagation delays, which can be advantageous in high-frequency RF applications where signal integrity is critical.
Characteristic Impedance: The substrate thickness influences the characteristic impedance of transmission lines on the PCB. In RF design, maintaining a consistent characteristic impedance along transmission lines is essential for minimizing signal reflections and ensuring optimal signal integrity. Thicker substrates typically result in higher characteristic impedance, while thinner substrates lead to lower characteristic impedance.

Contact info:- https://efpcb.wordpress.com/2023/12/26/the-effect-of-substrate-of-thickness-on-performance-of-rf-pcb/

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