IC Substrates

Polymer-metal composites combine the benefits of polymers and metals to create IC substrates with enhanced mechanical and electrical properties. These materials can be engineered to offer specific characteristics, such as flexibility, high thermal conductivity, and improved signal integrity. Polymer-metal composites are particularly interesting for flexible and wearable electronics. Advanced substrate materials can enable higher-density integration and facilitate the packaging of more components in a smaller footprint, thus contributing to the ongoing miniaturization of electronics.

Contact Info:-

High Quality PCB Co., Limited

Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China

Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China

Plant 2 address: Zhuhai, Guangdong, China

Plant 3 address: Dongguan, Guangdong, China

TEL: +86-755-23724206

WahtsApp: +86-189 2381 2997

Skype: shawnwang2006

Email: sales@efpcb.com