FC CSP substrate

This implies that the I/O cushions can be set at any segment of the outer layer of the chip and thusly the chip size can be decreased with a suitable hardware way. This is credited to the way that the shortfall of a holding wire adds to the minimization of transmission inductance. The vital elements of FC CSP substrate bundles:
It gives an immediate way to deal with interfacing the pass on and substrate and doesn't have the impact of z-level in the wire circles.

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Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China

Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China

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