FC CSP substrate

Description: This implies that the I/O cushions can be set at any segment of the outer layer of the chip and thusly the chip size can be decreased with a suitable hardware way. This is credited to the way that the shortfall of a holding wire adds to the minimization of transmission inductance. The vital elements of FC CSP substrate bundles: It gives an immediate way to deal with interfacing the pass on and substrate and doesn't have the impact of z-level in the wire circles. Contact Info:- High Quality PCB Co., Limited Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China Plant 2 address: Zhuhai, Guangdong, China Plant 3 address: Dongguan, Guangdong, China TEL: +86-755-23724206 WhatsApp: +86-189 2381 2997 Skype: shawnwang2006 Email: sales@efpcb.com

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